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semiconductor industry
product engineering
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Adhesive paths for production tool

For Tumakon and IMS, Engineering Analysis performed all the finite element analyses on an adhesive applicator production tool. It is used for application of high-precision adhesive paths (X, Y and Z axes). The tool is part of a modular production machine for the mobile phone industry. Speeds up to 40 millimetres in 640 milliseconds are achieved in combination with positioning accuracy of better than 0.02 millimetres.

Calculations for production tool

In addition to use of the finite element method (FEM/FEA) for analysis of the rigidity, the dynamic behaviour and accuracy were also determined. The rigidity and strength calculations contributed to making this a high-quality product and reducing the development time, resulting in cost savings.

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